xMEMS Starts Mass Production of 1.1mm Solid-State Cooling Chip for AI Glasses
xMEMS announced mass production of its μCooling solid-state cooling chips, targeting thermal bottlenecks in compact devices like AI smart glasses, with end products expected in early 2027.
MEMS technology company xMEMS Labs has announced that two models in its "μCooling" semiconductor cooling chip series (XMC-2400 and XMC-4800) entered mass production on October 20, 2026. The chip, approximately 1.1mm thick, uses piezoelectric MEMS technology to generate airflow through ultrasonic vibration of a silicon diaphragm, enabling active cooling without traditional rotating fan blades.
The technology primarily targets devices with extremely limited internal space, such as AI smart glasses and smartphones. At the CEATEC 2026 exhibition, Mark Wood, Vice President of xMEMS Japan, noted that surface temperatures exceeding 45°C on smart glass frames can compromise safety and comfort, while passive cooling often struggles to handle heat from high-performance processors. A live demonstration showed the frame side equipped with μCooling at 38°C, compared to 61°C on the uncooled side.
xMEMS currently offers three specifications: the smallest model, XMC-1200 (standard power consumption ~70mW), remains in the sampling stage, targeting optical systems and processors; the medium-sized XMC-2400 (max airflow 27cm³/s, power ~150mW) and large XMC-4800 (max airflow 47cm³/s, power ~240mW) have entered mass production. Wood stated that multiple companies are evaluating adoption, with end products featuring μCooling expected to launch in early 2027.