TPCA: Taiwan's PCB Output to Top NT$1 Trillion in 2026; AI-Driven Material Shortages May Last Until 2027
TPCA forecasts record-high Taiwan PCB output for 2026 driven by AI demand, with supply chain tightness expected to persist until at least 2027.
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According to the latest statistics from the Taiwan Printed Circuit Association (TPCA), boosted by expanding demand for AI servers, high-speed networking, and memory, Taiwan's total domestic and overseas PCB production value is projected to reach NT$1.1365 trillion in 2026, a year-on-year increase of 24.2%, marking a historic high. This growth is primarily driven by increased demand for advanced substrates, multilayer boards, and High-Density Interconnect (HDI) boards due to AI infrastructure construction, along with price hikes caused by tight supply of high-end materials.
The TPCA noted that since the second half of 2025, PCB supply chain tensions have expanded from high-end materials like Low CTE and HVLP4 to Copper Clad Laminate (CCL), ABF substrates, and manufacturing equipment. Although manufacturers are actively expanding capacity, with some new facilities expected to come online between 2027 and 2029, the tight supply situation is estimated to last until at least 2027, given sustained AI demand, material specification upgrades, and time-consuming customer certifications.