Supply Chain: TSMC SoIC Monthly Capacity to Top 30k Wafers in 2027, Chiayi AP7 Leads Expansion
According to supply chain reports, TSMC's SoIC advanced packaging monthly capacity is expected to grow from approximately 10,000 wafers in 2026 to over 30,000 in 2027. New capacity will primarily be located at the Chiayi AP7 fab in Taiwan, with the first US advanced packaging plant also prioritizing SoIC deployment to meet AI and HPC demand.
Driven by strong demand for AI and High-Performance Computing (HPC), TSMC is accelerating the expansion of its SoIC advanced packaging capacity, according to a report by MoneyDJ citing supply chain sources. The company's SoIC monthly capacity is estimated at around 10,000 wafers in 2026 and is projected to exceed 30,000 wafers in 2027, representing multiple-fold growth.
SoIC is a key technology for 3D IC vertical stacking, utilizing Hybrid Bonding to increase interconnect density and reduce power consumption. As AI chip complexity rises, SoIC has become another critical advanced packaging capability that TSMC is expanding, following CoWoS.
The new capacity will primarily be added at the Chiayi AP7 P2 facility in Taiwan, while existing capacity is mainly located at Zhunan AP6. Additionally, TSMC plans to prioritize SoIC deployment in its first planned advanced packaging plant in the United States to address US customers' needs for local supply chains.