South Korean AI Chip Startup DEEPX Demonstrates Cool-Running DX-M1 Processor with Butter Benchmark
DEEPX claims its DX-M1 chip runs 25-40°C cooler than competitors, shown via an unconventional butter melting test, though critics note lack of rigorous controls.
South Korean AI chip startup DEEPX recently showcased an unconventional thermal capability test by placing a knob of butter on its DX-M1 Neural Processing Unit (NPU). According to CNBC reports and statements from DEEPX CEO Kim Nok-won, while rival chips melted the butter within seconds under the same AI workload, the butter atop the DX-M1 remained solid. Kim claimed a temperature difference of 25 to more than 40 degrees Celsius compared with competitors.
DEEPX argues that excessive heat generated by processors is a significant part of contemporary data center design challenges, requiring extensive power and cooling apparatus. The company posits that making AI chips run cooler is the answer. The DX-M1, produced on Samsung 5nm since August 2025, has secured approximately $13.3 million in orders. DEEPX plans to move forward with the next-gen DX-M2 AI chip based on Samsung 2nm, aiming for mass production in H2 2027.
However, media outlets like Tom's Hardware noted significant gaps in the comparison information. Most notably, the speed at which each processor tackles the test workload was not disclosed. Critics point out that anyone can run a chip cool if power and clocks are scaled back through undervolting or underclocking. Furthermore, the DX-M1 targets edge computing and robotics rather than competing directly with power-gulping Nvidia Blackwell GPUs in data centers. Thus, while the demo highlights thermal efficiency in specific scenarios, it does not necessarily solve large-scale data center cooling issues.