South Korea's Suwon City and Sungkyunkwan University Sign Deal to Build Quantum/AI Semiconductor Packaging Verification Platform
Suwon City and Sungkyunkwan University in South Korea have signed an agreement to invest 11.5 billion KRW in building a verification infrastructure for quantum and AI semiconductor packaging, focusing on yield prediction for stacked AI chips.
According to a report by the Korean tech outlet ETNews, Suwon City in Gyeonggi Province and Sungkyunkwan University signed a business agreement on October 26, 2026, to launch the "Quantum/AI Semiconductor Packaging Verification Infrastructure Construction Project." The initiative plans a total investment of 11.5 billion KRW, comprising 10 billion KRW in national funding and 1.5 billion KRW from the city, running from July 2026 through December 2030.
The project aims to establish a semiconductor packaging verification platform and identify potential demand among enterprises. Key research areas include verifying advanced packaging for quantum/AI semiconductors and developing technologies to predict yields and pre-diagnose anomalies in multi-layer stacked AI chips. Advanced packaging integrates multiple chips into a single package to boost data transfer speeds and reduce footprint, a critical step for enhancing AI computing density.
Sungkyunkwan University will lead the consortium, which includes the Korea Electronics Technology Institute (KETI) and other research bodies. The partners also plan to create shared research spaces to support R&D and innovation for small and medium-sized enterprises. This move highlights deepening collaboration between local government and academia in the foundational manufacturing stages of AI hardware.