Lumentum Senior Director Christian Urricariet Explains Proof-of-Concept for 1060 nm VCSEL Optical D2D Connectivity in AI Scale-Up Networks
In a video, Lumentum's Senior Director of Product and Strategic Marketing, Christian Urricariet, discusses the company's proof-of-concept configuration for high-density, 1060 nm VCSEL-based optical die-to-die (D2D) connectivity aimed at AI scale-up networks. The demonstration showcases a potential path toward future co-packaged optics (CPO) and near-packaged optics (NPO) implementations to meet increasing bandwidth density demands.
Christian Urricariet, Senior Director of Product and Strategic Marketing at Lumentum, discusses the company's proof-of-concept configuration for high-density, 1060 nm VCSEL-based optical die-to-die (D2D) connectivity in a recent video. Developed in collaboration with ecosystem partners, the demonstration was showcased during ECOC 2026 in Málaga, Spain.
According to the video description, the configuration combines Lumentum's advanced-packaged VCSEL technology with D2D interface technology and high-density multimode fiber connectivity. Lumentum states that this approach demonstrates a potential path toward future co-packaged optics (CPO) and near-packaged optics (NPO) implementations as AI systems demand greater bandwidth density.
This resource is suitable for professional readers interested in the underlying optical interconnect technologies for AI infrastructure. It is important to note that the available information is limited to the introduction of a proof-of-concept demonstration; it does not include specific performance metrics, mass production timelines, or independent benchmark results.