Chinese Startup Zhengyuan Quantum Secures Near-100 Million RMB Angel Round to Develop Kilobit Superconducting Quantum Computer Using TSV Technology
Zhengyuan Quantum completed a near-100 million RMB funding round to tackle 3D packaging and cryogenic interconnect challenges, aiming to scale superconducting quantum computing to the kilobit level.
On November 10, 2026, Zhengyuan Quantum, a Chinese superconducting quantum computing startup founded in 2026, announced the completion of an angel round raising nearly 100 million RMB. Investors include Shenzhen Capital Group, Pudong Venture Capital, and others, with Multi-Dimensional Capital serving as the exclusive financial advisor. The funds will primarily support the research and development of a kilobit superconducting quantum computer, accelerating the validation of key technologies such as 3D packaging, cryogenic interconnects, and integrated measurement and control.
As the number of qubits on superconducting chips increases, traditional edge-based signal routing faces limitations in density and crosstalk. Zhengyuan Quantum's technical approach focuses on shifting connections to the third dimension by using Through-Silicon Via (TSV) technology to establish vertical electrical connections within silicon structures. Combined with 3D integrated packaging, this allows some signals to be routed vertically, alleviating the bottleneck of insufficient wiring boundaries in large-scale quantum systems—a critical engineering step toward kilobit-scale machines.
Founder Zheng Yarui holds a PhD from the Institute of Physics, Chinese Academy of Sciences, and studied under Professor Zhu Xiaobo at the University of Science and Technology of China. He previously led superconducting quantum hardware R&D at a major internet company. Co-founder Wu Dachao participated in research related to USTC's "Zuchongzhi-3" processor. The team's background indicates accumulated experience in chip design, manufacturing processes, and system integration. Currently, Zhengyuan Quantum has secured orders for core components like traveling wave parametric amplifiers and quantum chips, and is negotiating whole-machine requirements with potential clients.