Applied Materials Signs Agreement to Increase Stake in Dutch Firm Besi to ~20%, Bolstering AI Packaging Strategy
US semiconductor equipment giant Applied Materials announced it has signed an accelerated share purchase agreement to raise its stake in Netherlands-based BE Semiconductor Industries (Besi) to approximately 20%, deepening strategic ties in hybrid bonding and other key AI packaging technologies.
On October 26, 2026, US semiconductor equipment manufacturer Applied Materials, Inc. (Nasdaq: AMAT) filed a Form 8-K with the U.S. Securities and Exchange Commission announcing that it has entered into an accelerated share purchase agreement with Dutch public limited company BE Semiconductor Industries N.V. (Besi). Upon completion of the delivery of shares, Applied Materials' ownership stake in Besi will increase from its current level to approximately 20%.
The equity increase aims to solidify a long-term strategic partnership in advanced packaging. Applied Materials stated that as hybrid bonding technology and next-generation interconnect architectures become increasingly critical enablers of energy-efficient AI compute performance, this investment holds strategic significance. The two companies have collaborated since 2020, and Besi recently joined Applied Materials' EPIC Center as an Innovation Partner to co-develop new interconnect architectures and 3D IC integration platforms supporting the AI-driven scaling roadmap.
Notably, Applied Materials emphasized that this is a long-term investment, stating it currently has no intention to increase its stake beyond approximately 20% and does not intend to seek board representation at Besi. However, the delivery of shares remains subject to the expiration or termination of the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act, leaving final completion contingent on regulatory clearance.