NVIDIA Reportedly Standardizes NVHBM Base Dies on TSMC 3nm, Samsung Accepts Partial Outsourcing

NVIDIA is redefining who decides which process node gets used in the AI semiconductor supply chain. According to reports, NVIDIA has asked Samsung Electronics, SK Hynix and Micron to have the base dies—which assist computation beneath the HBM stack—for their next-generation custom memory NVHBM manufactured uniformly on TSMC's 3nm process. The core logic is standardization: when a single GPU must be compatible with HBM products from multiple vendors, verifying each base die's interface and power characteristics individually is extremely costly, while locking all base dies to the same process node dramatically reduces adaptation work.

Samsung had long emphasized its ability to integrate everything from memory to base die in-house as a core competitive strength. Its acceptance of TSMC foundry for NVHBM base dies represents a significant departure from that strategy.

However, this does not mean Samsung is overhauling its entire HBM approach. Samsung plans to continue using its own foundry for the base dies of its proprietary HBM4, HBM4E and products destined for other customers.

TSMC's record third-quarter 2026 results provide context for this landscape. Revenue reached NT$1.4942 trillion and net profit NT$763.1 billion, up roughly 51% and 69% year-on-year respectively, marking the sixth consecutive quarter of record earnings.

The engine behind those results is advanced process nodes. 2nm, which entered mass production at the end of last year, already accounts for 8% of wafer revenue; combined with 3nm and 5nm, advanced processes make up 69% of the total.